What to expect:
1. Lead the Power Packaging team of world top experts for research of advanced packaging technologies
2. Develop advanced semiconductor packaging technologies for power applications
3. Define the long-term roadmap and business plan of advanced packaging technology through internal requirements and external market analysis, trend analysis and supply-chain eco-system analysis
4. Identify business opportunities within Huawei’s business groups and search for potential partners and customers for power packaging technology
5. Optimize the power semiconductor packaging R&D process (maturity levels, project milestones, release checklists, ensure quality), also considering automotive requirements
What you bring along:
6. Master or PhD in Engineering, Power Electronics or similar related fields
7. Over 10 years of experience in the leading semiconductor companies, mainly in backend assembly, electronic package development with strong exposal to power applications
8. More than 5 years disciplinary management or team leading experience of R&D groups
9. Great understanding of power electronics, semiconductor industry, electronic package assembly
10. Excellent communication, presentation, negotiation and documentation skills in English and minimum one additional language (German or Chinese)
11. Intercultural sensitivity, dealing with changes and uncertainty as member of an engineering team, with experience functioning effectively in a multi-cultural and multi-geographical engineering environment
12. Open for international business trip or delegation
What we offer:
Verantwortungsvolle Aufgaben Eigenverantwortliches Arbeiten Konzernweites "Netzwerken" Mitarbeiter-Events Teamorientierte Arbeitsweise Verantwortungsvolle Aufgaben Eigenverantwortliches Arbeiten Konzernweites "Netzwerken" Mitarbeiter-Events Teamorientierte Arbeitsweise