About us About Li Auto: We're a leading Chinese new energy vehicle company that designs, develops, manufactures, and sells premium smart electric vehicles (EVs). Through product, technology, and business model innovations, we provide families with safer, more comfortable, and more convenient products and services. Our power module team is one of the leading teams in the power semiconductor industry, known for its exceptional capabilities and expertise in the power semiconductor field. With a strong focus on innovation and cutting-edge research, we have established ourselves as pioneers in the area of automotive grade SiC device packaging and application. Join our team and be part of an exciting journey where you can make a significant impact in the field of power semiconductors. Duties and responsibilities Track industry technology trends and develop packaging technology roadmaps for power modules; Leading the team to complete the pre-research of advanced packaging solutions, and organize technical cooperation with universities and research institutes; Leading team to complete the technical development of advanced power module, output design and process files; Support product development team to finish product development and import to factory for mass production. Requirements Education/Experience Bachelor degree or above in microelectronics, materials engineering, power electronics, mechanical electronics or other related majors. More than 8 years of experience in power semiconductor packaging product development or technology research and development. Knowledge Familiar with the overall situation of semiconductor packaging industry, and have good interpersonal relationships in industry. Possess a solid theoretical foundation for the microstructure, basic working principles, common failure modes and power electronic circuits of power semiconductor devices such as Si, SiC and GaN. Profound knowledge of packaging system design, thermal design, electrical design and reliability design, with industry-leading professional ability in one aspect. Familiar with the overall situation of semiconductor packaging industry, and have good interpersonal relationships in the industry. Familiar with power module design rules as well as simulation or structure design tools. Good command of English written and oral communication skills.