Duties and responsibilities Tracking SiC power module technology trends, defining power module process technology roadmap; Leading team tocomplete pre-research of advanced process technologies, organize technical cooperation with universities and research institutes; Leading team to develop advanced power module processes, output process files; Support productdevelopment team to finish product development and import to factory for mass production; Support mass production process teams to solve major process issues, improve reliability and yield.Requirements:Education/ExperienceBachelor degree or above, major in microelectronics, materials engineering, power electronics, mechanical electronics or other related fields; More than 8 years of experience in power semiconductor packaging product development or technology research and development; Experience in industry-leading product development and mass production is preferred; Proficient in packaging system design, thermal design, electrical design and reliability design, with industry-leading professional ability in one aspect; Have successfulexperience in SiC module development, and those who develop products to achieve mass production status are preferred.KnowledgeFamiliar with the overall situation of semiconductor packaging industry, and have good interpersonal relationships in industry; Profound knowledge of key packaging processes & corresponding equipment, e.G. Die Attach, Wire Bonding, Silver/Copper Sintering, Solder Reflow, Molding or Potting, etc.Skills and CompetenciesProactive, with pioneering spirit and a good sense of internal and external client; Passionate about engineering, with a strong spirit of innovation; Good command ofEnglish written and oral communication skills,Chinese is a plus; Excellent team coordination and communication skills.