About the role:
The experienced candidate with suitable skills is required to carry out key tasks and to meet the deadline of the project. The successful candidate will work with a high-power chip technology development team to design and develop state-of-the-art technology and deliver world-class high-power chips on the market.
What you will do:
* Responsible for building a technology platform for power device (IGBT/FRD) design and new technology development to meet customer requirements in a manufacturable and cost-effective way
* Responsible for improving the device's overall performance for the existing products, in particular, improving the device's reliability and robustness
* Performing TCAD process and device simulations, and layout design
* Creating and maintaining design rules and generation rules when required using controlled procedures
* Responsible for engineering device tests (static, dynamic, reliability, etc) and data analysis; part of manual testing might be involved
* Responsible to guide and work with chip and other function teams to meet timely deliveries
* Train and advance the skills of existing technical employees to expand their capability and responsibility
* Experience of IGBT design for EV/HEV application preferred
* Encourage and manage the process of producing technical publications and invention patents
What you will need:
Hard Skills:
* Hand-on experience in power device design and technology development, fine geometry trench and thin wafer technology is necessary; 12” experience is a plus
* Proficiency in TCAD process and device simulation
* Understanding of power device physics, fabrication and characterization principles
* Knowledge and experience in design for reliability and robustness of power devices
* Ability to address design and engineering issues and to provide suitable solutions
* More than 8 years of working experience in IGBT (or FRD) design and/or processing
* Proficient in reading English literature and writing in English
Soft Skills:
* Leadership skills in building and leading project teams in a global, intercultural environment– “exemplified engagement”
* Master’s degree or above, major in Microelectronics or semiconductor-related
* Good communication skills in both oral and written English
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